26154727
9781558999275
Enabling Technologies for 3-D Integration : Symposium Held November 27-29, 2006, Boston, Massachusetts, U.S.A
by Bower, Christopher Andrew, Materials Research Society, Meeting Staff
About this item
- Condition: Good
- Provider: Ergodebooks Contact
- Provider Rating: 82%
- Ships From: Multiple Locations
- Shipping: Standard
- Comments: Buy with confidence. Excellent Customer Service & Return policy. Ships Fast. 24*7 Customer Service.
Product details
- ISBN-13: 9781558999275
- ISBN: 1558999272
- Publication Date: 2009
- Publisher: Materials Research Society
AUTHOR
SUMMARY
An emerging technology or devices architecture called 3D IC integration is based on the system performance gains that can be achieved by stacking and vartically interconnecting distinct device chips The 3D concept of replacing long 2D interconnects with shorter vertical (3D) interconnect has the potential to alleviate the well-known interconnect.Bower, Christopher Andrew is the author of 'Enabling Technologies for 3-D Integration : Symposium Held November 27-29, 2006, Boston, Massachusetts, U.S.A', published 2009 under ISBN 9781558999275 and ISBN 1558999272.
[read more]
The ValoreBooks Guarantee
With our dedicated customer support team, you can rest easy knowing that we're doing everything we can to save you time, money, and stress.
