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38370322

9789814508599

Design and Modeling for 3DICs and Interposers (Wspc Series in Advanced Integration and Packaging)

Design and Modeling for 3DICs and Interposers (Wspc Series in Advanced Integration and Packaging)
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  • Condition: New
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  • Ships From: STERLING HEIGHTS, MI
  • Shipping: Standard
  • Comments: New, US edition. Satisfaction guaranteed!!
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Product details

  • ISBN-13: 9789814508599
  • ISBN: 9814508594
  • Publication Date: 2014
  • Publisher: World Scientific Publishing Company

AUTHOR

Madhavan Swaminathan, Ki Jin Han

SUMMARY

Madhavan Swaminathan is the author of 'Design and Modeling for 3DICs and Interposers (Wspc Series in Advanced Integration and Packaging)', published 2014 under ISBN 9789814508599 and ISBN 9814508594.

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